IMPROVED FILM THICKNESS MEASUREMENT
A method for determining the thickness of a film on a substrate is described. The substrate has a first major surface opposite a second major surface, and the film covers a portion of the first major surface. During a first measurement step, a first measuring beam is used to determine the distance f...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English French German |
Published |
02.05.2012
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A method for determining the thickness of a film on a substrate is described. The substrate has a first major surface opposite a second major surface, and the film covers a portion of the first major surface. During a first measurement step, a first measuring beam is used to determine the distance from a first reference point to a portion of the first major surface of the substrate that is not covered with the film, and a second measuring beam is used to determine the distance from a second reference point to a portion of the second major surface of the substrate that is not covered with film. During a second measurement step the first measuring beam is used to determine the distance from the first reference point to the film, and the second measuring beam is used to determine the distance from the second reference point to a portion of the second major surface of the substrate that is not covered with film. The thickness of the film so determined may be used as a control parameter in a method of applying an ink to an automotive glazing pane. |
---|---|
Bibliography: | Application Number: EP20100736779 |