Locking device and method for making the same

A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical...

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Bibliographic Details
Main Authors Deng, Tao, Russ, Boris Alexander, De Bock, Hendrik Pieter Jacobus, Wetzel, Todd Garrett
Format Patent
LanguageEnglish
French
German
Published 24.01.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink; and an actuator coupled to at least one of the locking device substrates. The fluid-permeable member is disposed between the locking device substrates. The actuator is configured to compress the fluid-permeable member by at least one of the locking device substrates forcing a portion of the fluid out of the fluid-permeable member and forming at least one fluid contact interface with the electrical assembly board and the heat sink in a reversible process. A method for making a locking device is also described.
Bibliography:Application Number: EP20110167467