Measurement and endpointing of sample thickness

An improved method for TEM sample creation. The use of a SEM-STEM detector in the dual-beam FIB/SEM allows a sample to be thinned using the FIB, while the STEM signal is used to monitor sample thickness. A preferred embodiment of the present invention can measure the thickness of or create S/TEM sam...

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Bibliographic Details
Main Authors MORIARTY, MICHAEL, PETERSON, BRENNAN, SCHAMPERS, RUUD, YOUNG, RICHARD
Format Patent
LanguageEnglish
French
German
Published 21.09.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Summary:An improved method for TEM sample creation. The use of a SEM-STEM detector in the dual-beam FIB/SEM allows a sample to be thinned using the FIB, while the STEM signal is used to monitor sample thickness. A preferred embodiment of the present invention can measure the thickness of or create S/TEM samples by using a precise endpoint detection method that is reproducible and suitable for automation. Preferred embodiments also enable automatic endpointing during TEM lamella creation and provide users with direct feedback on sample thickness during manual thinning. Preferred embodiments of the present invention thus provide improved methods for endpointing sample thinning and methods to partially or fully automate endpointing to increase throughput and reproducibility of TEM sample creation.
Bibliography:Application Number: EP20110165381