Illuminating device

• Main Authors: OBA, HITOSHI, NISHIMORI, NAOKI, SUGA, TAKAHIRO, YAMASHITA, YOSHIHIRO, ISHIKAWA, NOBUHARU, MATSUI, AKIRA, SUGIYAMA, KOSUKE
• Format: Patent
• Language: English; French; German
• Published: 14.09.2011
• Subjects: ACCESSORIES THEREFOR; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HEATING; HOLOGRAPHY; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; PHOTOGRAPHY; PHYSICS; PRINTED CIRCUITS; TESTING; WEAPONS

To provide a manufacturing method for manufacturing a plurality of types of illuminating devices having different specifications while suppressing cost. A substrate includes a common portion having flexibility and a plurality of units bendable with respect to the common portion, where the common portion includes a pad that is extended in the horizontal direction in the plane of drawing and that is arranged for every predefined interval In the present manufacturing method, a substrate piece is created by cutting the substrate mounted with the light emitting element in a first direction, the common portion in the substrate piece is formed according to the illuminating device to be manufactured, the relative position of the individual portion with respect to the formed common portion is respectively positioned, and the wiring for supplying power to the pad in the substrate piece is formed.