AN LED PACKAGE AND A BACKLIGHT UNIT COMPRISING SAID LED PACKAGE

• Main Authors: KIM, HYUNG-SUK, HAHM, HUN-JOO, PARK, JUNG-KYU, YUN, MI-JEONG, KIM, DAE-YEON, KIM, GEUN-YOUNG, KIM, YOUNG-TAEK, PARK, JONG-JIN, HAN, SEONG-YEON, KIM, DO-HUN, LEE, JUNG-HUN, PARK, YOUNG-SAM, ONISHI, TOMOHISA, KIM, DAE-HYUN
• Format: Patent
• Language: English; French; German
• Published: 16.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.