PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT, CORRESPONDING COMPOSITE COMPONENT AND CORRESPONDING MICROMECHANICAL COMPONENT
A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
04.11.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component. |
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Bibliography: | Application Number: EP20090761542 |