Method for releasing a component from a thermal release tape

Method and system for releasing a component from a thermal release tape, the method comprising: attaching a component or an object to be diced into components, for example a wafer, to the thermal release tape; optionally singulating (cutting) the object into components (dies); applying heat to one o...

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Bibliographic Details
Main Author VERHELST, BAS
Format Patent
LanguageEnglish
French
German
Published 12.01.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Method and system for releasing a component from a thermal release tape, the method comprising: attaching a component or an object to be diced into components, for example a wafer, to the thermal release tape; optionally singulating (cutting) the object into components (dies); applying heat to one of the component and the thermal release tape to reduce adhesive effect between the thermal release tape and the component or to release the component completely from the thermal release tape; and releasing the component by picking up or by dropping.
Bibliography:Application Number: EP20090165092