Polyphenylene ether thermoplastic resin composition, and molded product using the same

Disclosed are a polyphenylene-ether-based thermoplastic resin composition that includes: (A) a mixed resin of (A-1) a polyphenylene-ether-based resin and (A-2) a polyamide resin; (B) a styrene-based copolymer resin; (C) a conductive additive; and (D) mica, and a molded product using the same.

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Bibliographic Details
Main Authors Shim, In-Sik, Huh, Jin-Young, Ha, Doo-Han
Format Patent
LanguageEnglish
French
German
Published 24.01.2018
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
METALLURGY
NANOTECHNOLOGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Disclosed are a polyphenylene-ether-based thermoplastic resin composition that includes: (A) a mixed resin of (A-1) a polyphenylene-ether-based resin and (A-2) a polyamide resin; (B) a styrene-based copolymer resin; (C) a conductive additive; and (D) mica, and a molded product using the same.
Bibliography:Application Number: EP20100166908