DEVICE COMPRISING AN ENCAPSULATION UNIT

A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3)...

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Bibliographic Details
Main Authors SCHMID, Christian, HEUSER, Karsten, KLEIN, Markus, SCHLENKER, Tilman, ZULL, Heribert, PÄTZOLD, Ralph
Format Patent
LanguageEnglish
French
German
Published 24.03.2021
Subjects
ELECTRICITY
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Summary:A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).
Bibliography:Application Number: EP20090705293