A material for packaging electronic components

The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that an...

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Bibliographic Details
Main Authors KUEPPER, ANTON, WEINMANN, CHRISTIAN
Format Patent
LanguageEnglish
French
German
Published 25.07.2012
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
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Summary:The invention provides a material for packaging of electronic components comprising a structured layer, wherein said structured layer comprises a mesh of cells, each cell comprising an electrically conductive rim and an electrically non conductive interior, said cells being interconnected so that any two adjacent cells share at least a portion of their respective rims.
Bibliography:Application Number: EP20090157250