METHOD FOR PROVIDING A PATTERNED METAL LAYER HAVING HIGH CONDUCTIVITY

Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for elec...

Full description

Saved in:
Bibliographic Details
Main Authors MALAJOVICH, IRINA, SCHIFFINO, RINALDO, SORIA, KEYS, DALEN, E, ZUMSTEG, FREDRICK, CLAUS, JR, KEUSSEYAN, ROUPEN, LEON, GAO, FENG, JOHNSON, LYNDA, KAYE
Format Patent
LanguageEnglish
French
German
Published 19.10.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COLOUR PRINTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINING MACHINES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
STAMPS
TRANSPORTING
TYPEWRITERS
Online AccessGet full text

Cover

More Information
Summary:Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.
Bibliography:Application Number: EP20080842620