Conductor board

The printed circuit board (20) comprises a layer sequence which is formed from multiple structure layers (1,2,3,4,5,6,7,8,9). The structure layers are arranged together in an edge area in a displaced manner, such that a staircase shaped profile supports a plug device (22). An intermediate layer is a...

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Bibliographic Details
Main Authors ROHNE, KLAUS, CHOWANIEC, MICHAEL
Format Patent
LanguageEnglish
French
German
Published 23.06.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The printed circuit board (20) comprises a layer sequence which is formed from multiple structure layers (1,2,3,4,5,6,7,8,9). The structure layers are arranged together in an edge area in a displaced manner, such that a staircase shaped profile supports a plug device (22). An intermediate layer is arranged on a layer carrying a conductive path (24) coming out from a maximum-point and from a central point of a longitudinal axis (L). Um bei einer Leiterplatte (20) umfassend einen aus einer Mehrzahl von Strukturschichten (1,...,9) ausgebildeten Lagenaufbau, eine Packungsdichte für ein Steckmittel zur Kontaktierung über Kontaktflächen, welche mit den Leiterbahnen (24) in Verbindung stehen, wird vorgeschlagen, dass die Strukturschichten (1,...,9) in einem Randbereich als ein treppenförmiges Profil zur Aufnahme des Steckmittels ausgebildet sind.
Bibliography:Application Number: EP20080172223