LATENT CURING AGENTS, EPOXY RESIN COMPOSITIONS CONATING THE SAME, SEALING MATERIALS, AND ORGANIC EL DISPLAYS

The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each c...

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Main Authors CHIDA, MITSUAKI, NAKANO, TAKASHI, YOSHIMURA, NARITOSHI, YAMAMOTO, YUOGO, ITO, YUICHI, TAMATANI, HIROAKI
Format Patent
LanguageEnglish
French
German
Published 23.06.2010
Subjects
ACYCLIC OR CARBOCYCLIC COMPOUNDS
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC CHEMISTRY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N-N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
Bibliography:Application Number: EP20080868547