High thermal conductive aluminum nitride sintered body

The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m · K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (I Al 2 Y 4 O 9 /I AIN ) of X-ray diffraction intensity (I Al 2 Y 4 O 9 ) of Al 2 Y...

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Bibliographic Details
Main Authors MIYASHITA, Kimiya, KOMATSU, Michiyasu
Format Patent
LanguageEnglish
French
German
Published 23.05.2018
Subjects
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
LIME, MAGNESIA
METALLURGY
REFRACTORIES
SLAG
TREATMENT OF NATURAL STONE
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Summary:The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m · K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (I Al 2 Y 4 O 9 /I AIN ) of X-ray diffraction intensity (I Al 2 Y 4 O 9 ) of Al 2 Y 4 O 9 (201 plane) with respect to X-ray diffraction intensity (I AIN ) of aluminum nitride (101 plane) is 0.002 to 0.03. According to the foregoing structure, there can be provided an aluminum nitride sintered body having a high thermal conductivity and excellent heat radiating property.
Bibliography:Application Number: EP20100002627