Electronic module with heat sink

An electronic module includes a printed circuit board (24) with a heat producing electrical component (26) assembled in an insulating housing (12). The component is adjacent a thermally conducting heat sink (30) with a thermally conductive material (32) disposed therebetween. Integral with the heat...

Full description

Saved in:
Bibliographic Details
Main Authors WILSON, SCOTT E, KRISHNAN, G. VENKATA, HINZE, LEE R
Format Patent
LanguageEnglish
French
German
Published 11.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An electronic module includes a printed circuit board (24) with a heat producing electrical component (26) assembled in an insulating housing (12). The component is adjacent a thermally conducting heat sink (30) with a thermally conductive material (32) disposed therebetween. Integral with the heat sink is a thermally conductive runner (38), partially encased in the housing wall, connecting the heat sink to a thermally conductive port (22). The port is coupled to a base structure when the housing is attached to the base (14), forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.
Bibliography:Application Number: EP20090170763