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Summary:A transfer film for firing which has a multilayer structure including a functional pattern and a pressure-sensitive adhesive layer. The multilayer structure is free from a shape failure of the functional pattern and a decrease in adhesive force of the adhesive layer, and has the excellent transferability to a substrate. The transfer film gives a fired functional pattern free from defects such as a shape or function failure. The transfer film for firing is one for use in forming a fired functional pattern by transferring a multilayer structure including a functional pattern to a surface of a substrate and firing it. The transfer film comprises a release film and a multilayer structure formed so as to be in contact with one of the surfaces of the release film. The multilayer structure includes a functional pattern and a contact layer which has been formed so as to be in direct contact with the surface of the functional pattern and is constituted of one layer or a larger number of layers. The functional pattern comprises inorganic particles and an organic substance removable by firing. The contact layer comprises an organic substance and a solvent both removable by firing. The organic substance contained in the functional pattern is incompatible with the solvent contained in the contact layer.
Bibliography:Application Number: EP20080765579