ELECTRICAL INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first elect...

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Main Authors NAH, JAE-WOONG, SHIH, DA-YUAN, BUCHWALTER, STEPHEN, LESLIE, GRUBER, PETER, ALFRED, FURMAN, BRUCE, KENNETH
Format Patent
LanguageEnglish
French
German
Published 24.02.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
Bibliography:Application Number: EP20080718206