Structure and method for mounting a heat-generating component

A structure for mounting a heat-generating component includes a circuit board on which a heat-generating component is mounted, a base on which the circuit board is disposed upright, a cover having thermal conductivity, a heat-conductive member electrically isolated from the heat-generating component...

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Bibliographic Details
Main Author KONTANI, KAZUYOSHI
Format Patent
LanguageEnglish
French
German
Published 29.04.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A structure for mounting a heat-generating component includes a circuit board on which a heat-generating component is mounted, a base on which the circuit board is disposed upright, a cover having thermal conductivity, a heat-conductive member electrically isolated from the heat-generating component and a heat transfer plate. The heat transfer plate is attached to the circuit board so as to extend in the sliding direction of the cover to cover a surface of the heat-conductive member. The cover presses the heat transfer plate by an inner surface thereof against the heat-conductive member in a direction perpendicular to the heat-conductive member so that the heat-generating component is thermally connected to the inner surface of the cover through the heat-conductive member and the heat transfer plate.
Bibliography:Application Number: EP20090004493