METHOD FOR PROCESSING THE SURFACE OF POLYMER SUBSTRATES, SUBSTRATES THUS OBTAINED AND USE THEREOF IN THE PRODUCTION OF MULTILAYERED MATERIALS
The invention relates to a method for processing the surface of polymer substrates, during which the substrate is subjected to a dielectric-barrier electric discharge of the filament type in a gaseous processing mixture containing at least a carrier gas and an active gas and under a pressure substan...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
10.07.2013
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a method for processing the surface of polymer substrates, during which the substrate is subjected to a dielectric-barrier electric discharge of the filament type in a gaseous processing mixture containing at least a carrier gas and an active gas and under a pressure substantially equal to the atmospheric pressure, characterized in that the active gas is selected from the group including a mono-unsaturated or poly-unsaturated linear or branched hydrocarbon preferably containing 2 to 10 carbon atoms, more preferably 2 to 5 carbon atoms and even more preferably 2 or 3 carbon atoms, the residual oxygen content of the processing mixture being lower than 250 ppm, preferably lower than 100 ppm, and more preferably lower than 50 ppm. |
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Bibliography: | Application Number: EP20070866496 |