ADHESIVE COMPOSITION FOR REMOVABLE PRESSURE SENSITIVE ADHESIVE LABEL

• Main Authors: FOUQUAY, STEPHANE, ANDRE, GOUBARD, DAVID
• Format: Patent
• Language: English; French; German
• Published: 24.10.2012
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

A hot melt pressure sensitive adhesive composition (I) comprises (a) 25-40% mixture of 20-90% styrene-butadiene-styrene (SBS) triblock copolymer(s) and 10-80% styrene-butadiene (SB) diblock copolymer(s), the styrene unit content of the mixture being 15-40%, (b) 45-75% compatible tackifying resin(s) of softening point 80-150[deg] C and (c) 0.5-5.5% fatty acid(s) (optionally in alkali(ne earth) metal salt form) with 10-22C hydrocarbon chains. Independent claims are included for: (1) a multilayer system consisting of an adhesive layer of (I), between a printable support layer (consisting of one or more layers of paper of polymer film) and a protective layer; (2) a self-adhesive label, obtained by conversion of the multilayer system; (3) an article covered by the label; and (4) a method for recycling the labeled article, including the stage of removing the label by immersing the article in basic aqueous solution at 60-100[deg] C.