Wafer

• Main Authors: HUJIE, KAZUO, MORITA, ETSUROU, ONO, ISOROKU
• Format: Patent
• Language: English; French; German
• Published: 18.04.2012
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

A wafer is produced in a step of polishing a predetermined face of the wafer to flatten said predetermined face while supplying a polishing liquid onto a bonded abrasive cloth, wherein the bonded abrasive cloth comprises an urethane bonding material consisting of a soft segment having a polyfunction...