Wafer

A wafer is produced in a step of polishing a predetermined face of the wafer to flatten said predetermined face while supplying a polishing liquid onto a bonded abrasive cloth, wherein the bonded abrasive cloth comprises an urethane bonding material consisting of a soft segment having a polyfunction...

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Bibliographic Details
Main Authors HUJIE, KAZUO, MORITA, ETSUROU, ONO, ISOROKU
Format Patent
LanguageEnglish
French
German
Published 18.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:A wafer is produced in a step of polishing a predetermined face of the wafer to flatten said predetermined face while supplying a polishing liquid onto a bonded abrasive cloth, wherein the bonded abrasive cloth comprises an urethane bonding material consisting of a soft segment having a polyfunctional isocyanate and a hard segment having a polyfunctional polyol and having an expansion ratio of 1.1-4 times and silica having an average particle size of 0.2-10 µm and a hydroxy group. The cloth has a given ratio of the hard segment in the urethane bonding material, a given volume ratio of silica, and a given Shore D hardness.
Bibliography:Application Number: EP20090006718