Optical transceiver module with improved noise reduction

If a light-emitting side FOT 35 and a light-receiving side FOT 36 each having an optical element and a plurality of pin-like lead frames 55 is covered by a shield case 37 formed of an electrically conductive metallic plate, a ground pin 71 of the shield case 37 is positioned immediately behind a lea...

Full description

Saved in:
Bibliographic Details
Main Author OZAKI, MASAHITO
Format Patent
LanguageEnglish
French
German
Published 25.03.2009
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:If a light-emitting side FOT 35 and a light-receiving side FOT 36 each having an optical element and a plurality of pin-like lead frames 55 is covered by a shield case 37 formed of an electrically conductive metallic plate, a ground pin 71 of the shield case 37 is positioned immediately behind a lead frame 55b which functions as a ground pin among the plurality of lead frames 55.
Bibliography:Application Number: EP20080016298