METHOD FOR ATTACHING ELECTRONIC COMPONENTS TO A SUPPORT BY MEANS OF PRESSURE SINTERING AND CIRCUIT ARRANGEMENT

The invention relates to a method for attaching electronic components (3) to a support by means of pressure sintering comprising the steps: a) coating at least one film (1) as support with a noble metal alloy (2); b) application of a metal containing contact layer (4) to contact surfaces of the at l...

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Bibliographic Details
Main Authors WAAG, ANDREAS, PALM, GERHARD
Format Patent
LanguageEnglish
French
German
Published 25.03.2009
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
SEMICONDUCTOR DEVICES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:The invention relates to a method for attaching electronic components (3) to a support by means of pressure sintering comprising the steps: a) coating at least one film (1) as support with a noble metal alloy (2); b) application of a metal containing contact layer (4) to contact surfaces of the at least one electronic component (3) for attaching; c) positioning the at least one electronic component (3) on the at least one film (1) such that the at least one contact surface rests on the noble metal alloy (2) of the at least one film (1) and d) subjecting the arrangement of at least one film (1) and at least one electronic component (3) to pressure and heat for pressure sintering.
Bibliography:Application Number: EP20070785597