PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
27.05.2015
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Subjects | |
Online Access | Get full text |
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Summary: | An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided. |
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Bibliography: | Application Number: EP20070762101 |