Method of manufacturing an organic device

• Main Authors: NIIDA, EIKI, HOSHI, SAKUTARO, SAITO, YASUSHI, HARADA, MASAYUKI, TSUTSUI, YUSUKE, KAWAUCHI, HIROYASU
• Format: Patent
• Language: English; French; German
• Published: 29.10.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of manufacturing an organic device includes the following steps. The first step is a step of forming a plurality of organic elements in the form of a matrix on a brittle substrate. Each of the organic elements is provided with an electrically connecting portion which electrically connects the organic element to an external circuit. The second step is a step of forming a sealing film on each organic element by a wet process with at least a part of the connecting portion covered with an adhesive masking material. The third step is a step of removing an adhesive deposit after peeling off the adhesive masking material. The fourth step is a step of forming a plurality of scribe lines on the brittle substrate. The fifth step is a step of breaking the brittle substrate along the scribe lines.