Inkjet Printed Wirings, Encapsulant and Shielding

A method of connecting a chip (220) to a package (210) in a semiconductor device (200) includes printing an encapsulant (250) to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material (260) on the encapsulant in a predetermined pattern bet...

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Bibliographic Details
Main Authors GULVIN, PETER M, NYSTROM, PETER J, MEYERS, JOHN P
Format Patent
LanguageEnglish
French
German
Published 17.10.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of connecting a chip (220) to a package (210) in a semiconductor device (200) includes printing an encapsulant (250) to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material (260) on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant (270) over the printed conductive material curing at least the second layer of encapsulant.
Bibliography:Application Number: EP20080152080