SEMICONDUCTOR DEVICE FABRICATED USING SUBLIMATION

The invention provides a method of fabricating a semiconductive device [200]. In this embodiment, the method comprises depositing a hydrocarbon layer [294] over a semiconductive substrate, forming an interconnect structure [295, 297] within the hydrocarbon layer [294], and removing the hydrocarbon l...

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Bibliographic Details
Main Authors RAMAPPA, Deepak A, GULDI, Richard L, POAG, Frank, HAIDER, Asad
Format Patent
LanguageEnglish
French
German
Published 05.06.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a method of fabricating a semiconductive device [200]. In this embodiment, the method comprises depositing a hydrocarbon layer [294] over a semiconductive substrate, forming an interconnect structure [295, 297] within the hydrocarbon layer [294], and removing the hydrocarbon layer [294] by sublimation.
Bibliography:Application Number: EP20060846565