METHOD OF GLASS SUBSTRATE WORKING AND GLASS PART

• Main Authors: IMAMURA, TOMONORI, NAKAMURA, YASUSHI, SAITO, YASUHIRO, HIDAKA, TAKESHI, OKAMOTO, SHINYA, KOYO, HIROTAKA, TSUNETOMO, KEIJI
• Format: Patent
• Language: English; French; German
• Published: 21.09.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES USING STIMULATED EMISSION; ELECTRICITY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A glass substrate processing method includes a step of irradiating laser light L onto a glass substrate 1 such that the laser light L is focused within the glass substrate 1, thereby forming a high density area 3 that has a higher density than areas where the laser light L is not irradiated around the portion where the laser light L is focused; and a step of performing chemical etching on the glass substrate 1 using an etching solution such that at least a portion of the high density area is allowed to remain, thereby forming a projection 2 on a surface 1a of the glass substrate 1.