LASER PEENING METHOD, PRODUCT AND APPARATUS WITH SUCH PRODUCT, USING ABLATION LAYERS TO PREVENT PITTING DURING LASER PEENING

A hybrid ablation layer that comprises a separate under layer is applied to a material to prevent pitting resulting from laser peening. The underlayer adheres to the surface of the workpiece to be peened and does not have bubbles and voids that exceed an acceptable size. One or more overlayers are p...

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Bibliographic Details
Main Author HACKEL, LLOYD, A
Format Patent
LanguageEnglish
French
German
Published 27.08.2008
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Summary:A hybrid ablation layer that comprises a separate under layer is applied to a material to prevent pitting resulting from laser peening. The underlayer adheres to the surface of the workpiece to be peened and does not have bubbles and voids that exceed an acceptable size. One or more overlayers are placed over and in contact with the underlayer. Any bubbles formed under the over layers are insulated from the surface to be peened. The process significantly reduces the incidence of pits on peened surfaces.
Bibliography:Application Number: EP20060849830