Insulating board with a sandwich structure as protection against electromagnetic waves

The board has a protection layer (3) lying between upper and lower board elements (1, 2) i.e. soft wood fiber boards, which exhibit identical dimensions. The elements are fastened relative to each other in a displaceable manner such that a layer (t) is formed between the elements. The protection lay...

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Bibliographic Details
Main Authors BROMBACHER, VOLKER, HAENEL, ANNEMARIE
Format Patent
LanguageEnglish
French
German
Published 14.04.2010
Subjects
BUILDING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEILINGS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
ROOFS
WALLS, e.g. PARTITIONS
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Summary:The board has a protection layer (3) lying between upper and lower board elements (1, 2) i.e. soft wood fiber boards, which exhibit identical dimensions. The elements are fastened relative to each other in a displaceable manner such that a layer (t) is formed between the elements. The protection layer covers more than half of the layer, where the protection layer does not extend over an outer limit of the board. The protection layer is made of electrically conductive foil and/or copper wire gauze. The elements are made of a plastic material and/or wood fiber material and/or wood. Independent claims are also included for the following: (1) a method for manufacturing a multilayer insulating board (2) a method for insulating and protecting building or building parts.
Bibliography:Application Number: EP20060026797