METHOD FOR PRODUCING A SENSOR ARRANGEMENT COMPRISING A MONOLITHICALLY INTEGRATED CIRCUIT

The method involves producing a partial structure, which is attached to a micromechanical sensor structure (20) simultaneously with another partial structure, which is attached to a monolithic integrated circuit (30). Process variation of the former partial structure is made with the latter unchangi...

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Bibliographic Details
Main Authors BENZEL, Hubert, ARMBRUSTER, Simon
Format Patent
LanguageEnglish
French
German
Published 04.07.2018
Subjects
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:The method involves producing a partial structure, which is attached to a micromechanical sensor structure (20) simultaneously with another partial structure, which is attached to a monolithic integrated circuit (30). Process variation of the former partial structure is made with the latter unchanging partial structure, for adjustment of structural characteristics of the sensor structure. An independent claim is also included for a sensor arrangement with a monolithic integrated circuit and a micromechanical sensor structure.
Bibliography:Application Number: EP20060793795