METHOD FOR PRODUCING A SENSOR ARRANGEMENT COMPRISING A MONOLITHICALLY INTEGRATED CIRCUIT
The method involves producing a partial structure, which is attached to a micromechanical sensor structure (20) simultaneously with another partial structure, which is attached to a monolithic integrated circuit (30). Process variation of the former partial structure is made with the latter unchangi...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
04.07.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The method involves producing a partial structure, which is attached to a micromechanical sensor structure (20) simultaneously with another partial structure, which is attached to a monolithic integrated circuit (30). Process variation of the former partial structure is made with the latter unchanging partial structure, for adjustment of structural characteristics of the sensor structure. An independent claim is also included for a sensor arrangement with a monolithic integrated circuit and a micromechanical sensor structure. |
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Bibliography: | Application Number: EP20060793795 |