CIRCUIT CONNECTION STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR SUBSTRATE FOR CIRCUIT CONNECTION STRUCTURE
A circuit connection structure which exhibits an excellent adhesiveness between a heat resistant resin film and a circuit adhesive member even under high temperature and high humidity by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatme...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
07.05.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A circuit connection structure which exhibits an excellent adhesiveness between a heat resistant resin film and a circuit adhesive member even under high temperature and high humidity by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatment to improve the adhesiveness is provided. In a circuit connection structure 1A, a semiconductor substrate 2 and a circuit member 3 are adhered by a circuit adhesive member 4 sandwiched therewith. First circuit electrode 5 on the semiconductor substrate 2 and second circuit electrode 7 on the circuit member 3 are connected electrically by conductive particles 8 in the circuit adhesive member 4. A surface modification is given to the semiconductor substrate 2 by plasma treatment using gas containing nitrogen, ammonia and the like. Therefore, the heat resistant resin film 5 on the semiconductor substrate 2 and the circuit adhesive member 4 are firmly adhered for a long period of time even under the high temperature and high humidity. |
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Bibliography: | Application Number: EP20060782863 |