LIGHT-EMITTING MODULE

The light-emitting module (30) according to the present invention comprises a heat dissipation element (300), a substrate (50), for example a metal core printed circuit board (MCPCB) or FR4 board, which is coupled to one or more light-emitting elements (315) and provides a means for operative connec...

Full description

Saved in:
Bibliographic Details
Main Author MATHESON, George E
Format Patent
LanguageEnglish
French
German
Published 19.08.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The light-emitting module (30) according to the present invention comprises a heat dissipation element (300), a substrate (50), for example a metal core printed circuit board (MCPCB) or FR4 board, which is coupled to one or more light-emitting elements (315) and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element (40) which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.
Bibliography:Application Number: EP20060741539