Method of forming individual formed-on-foil thin capacitors

Disclosed is a method of forming individual thin-film capacitors for embedding inside printed wiring boards or organic semiconductor package substrates, which includes removal of selected portions of the capacitor by sandblasting or other means so that the ceramic dielectric does not come into conta...

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Bibliographic Details
Main Authors AMEY, DANIEL IRWIN, JR, ONKEN, MATTHEW T, MCGREGOR, DAVID ROSS, BORLAND, WILLIAM
Format Patent
LanguageEnglish
French
German
Published 13.02.2008
Subjects
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
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Summary:Disclosed is a method of forming individual thin-film capacitors for embedding inside printed wiring boards or organic semiconductor package substrates, which includes removal of selected portions of the capacitor by sandblasting or other means so that the ceramic dielectric does not come into contact with acid etching solutions.
Bibliography:Application Number: EP20070253149