UBM PAD, SOLDER CONTACT AND METHOD FOR PRODUCTION OF A SOLDER CONNECTION

A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with regard to a solder...

Full description

Saved in:
Bibliographic Details
Main Authors ENGELMANN, GUNTER, WOLF, JUERGEN, JURENKA, CLAUDIA, REICHL, HERBERT
Format Patent
LanguageEnglish
French
German
Published 02.03.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with regard to a solder material that the presence of the second material prevents any metallurgical reactions of the first material with the solder material in the entire temperature range of connecting and of the operation of the structured electronic device which are detrimental to the reliability of the overall joint.
Bibliography:Application Number: EP20060742995