COMPRESSION AND COLD WELD SEALING METHODS AND DEVICES

A method of forming an electrical via connection by compressing a first non-conductive substrate having an aperture comprising a layer of a first electrically conductive material with a second non-conductive substrate having a projecting member which is formed of or coated with a second electrically...

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Bibliographic Details
Main Authors COPPETA, Jonathan R, SHEPPARD, Norman F. Jr, SHELTON, Kurt, SNELL, Douglas B
Format Patent
LanguageEnglish
French
German
Published 26.12.2018
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
TRANSPORTING
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Summary:A method of forming an electrical via connection by compressing a first non-conductive substrate having an aperture comprising a layer of a first electrically conductive material with a second non-conductive substrate having a projecting member which is formed of or coated with a second electrically conductive material. The compression locally deforms and shears the first and/or second electrically conductive materials to form a bond and electrical connection between the first and second electrically conductive materials. An electrical via is made by the method.
Bibliography:Application Number: EP20050818218