MOUNTING CONDITION DETERMINING METHOD, MOUNTING CONDITION DETERMINING DEVICE, AND MOUNTING APPARATUS

According to the present invention, mounting conditions are determined to become closer to a setting value of a parameter regarding electricity consumption. The present invention provides a method of determining mounting conditions under which a piece of equipment mounts a component onto a substrate...

Full description

Saved in:
Bibliographic Details
Main Authors YOKOI, TAKAAKI, MAENISHI, YASUHIRO, KURATA, HIROAKI, NAKAHARA, KAZUHIKO, HIRAI, WATARU, FUJITA, MASAKATSU, KONISHI, CHIKASHI, YAMAZAKI, TAKUYA
Format Patent
LanguageEnglish
French
German
Published 31.10.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:According to the present invention, mounting conditions are determined to become closer to a setting value of a parameter regarding electricity consumption. The present invention provides a method of determining mounting conditions under which a piece of equipment mounts a component onto a substrate. The method includes: obtaining a setting value of a parameter regarding electricity consumption required to mount the component; obtaining an actual value of the parameter based on current mounting conditions; and determining new mounting conditions based on a result of comparing the setting value with the actual value.
Bibliography:Application Number: EP20060713727