A SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING IT

A method of forming a semiconductor device, the method including forming a substrate including a first surface having a non-doped region, forming an insulative material over the first surface of the substrate, forming a first conductive material over the first insulative material, forming an opening...

Full description

Saved in:
Bibliographic Details
Main Authors DODD, Simon, TOM, Dennis W, MILLER, Richard Todd, BRYANT, Frank R, MCMAHON, Terry E, HINDMAN, Gregory T, WANG, S. Jonathan
Format Patent
LanguageEnglish
French
German
Published 20.03.2019
Subjects
BASIC ELECTRIC ELEMENTS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
Online AccessGet full text

Cover

More Information
Summary:A method of forming a semiconductor device, the method including forming a substrate including a first surface having a non-doped region, forming an insulative material over the first surface of the substrate, forming a first conductive material over the first insulative material, forming an opening in the first conductive material that forms a path to the substrate that is substantially free of the first conductive material and the first insulative material, forming a second insulative material over the first conductive material, and forming a second conductive material over the second insulative material, wherein the second conductive material is formed in the opening and contacts the non-doped region of the substrate.
Bibliography:Application Number: EP20050801164