Packaged electronic device and semiconductor device with a back-side conductive layer

An electronic device has a substrate (10), a conductive layer (12) and a substrate mounted portion (20). The substrate has a circuit portion (14) used from 60 GHz to 80 GHz. The conductive layer (12) is provided directly on a face of the substrate that is opposite side of the circuit portion. The fa...

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Bibliographic Details
Main Author Nunokawa, Mitsuji
Format Patent
LanguageEnglish
French
German
Published 06.03.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device has a substrate (10), a conductive layer (12) and a substrate mounted portion (20). The substrate has a circuit portion (14) used from 60 GHz to 80 GHz. The conductive layer (12) is provided directly on a face of the substrate that is opposite side of the circuit portion. The face having the circuit portion of the substrate is mounted face down on the substrate mounted portion. A thickness of the conductive layer is a thickness where a sheet resistance of the conductive layer is 1/4 to 4 times of a resistance component of an impedance of the substrate.
Bibliography:Application Number: EP20060125848