Metal duplex and method
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
07.05.2008
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Subjects | |
Online Access | Get full text |
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