Metal duplex and method

Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.

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Bibliographic Details
Main Authors KWOK, RAYMUND W. M, LAU, DANNY
Format Patent
LanguageEnglish
French
German
Published 07.05.2008
Subjects
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Summary:Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.
Bibliography:Application Number: EP20060254661