Metal duplex and method
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
14.03.2007
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Subjects | |
Online Access | Get full text |
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Summary: | Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates. |
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Bibliography: | Application Number: EP20060254660 |