Microplasma deposition methods

• Main Authors: BLANKENSHIP, DONN R, PIETRUSCA, NORMAN A, ZAJCHOWSKI, PAUL H, RUTZ, DAVID A, SHUBERT, GARY
• Format: Patent
• Language: English; French; German
• Published: 28.10.2015
• Subjects: BLASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINE PLANTS IN GENERAL; HEATING; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LIGHTING; MACHINES OR ENGINES IN GENERAL; MECHANICAL ENGINEERING; METALLURGY; NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS; STEAM ENGINES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; WEAPONS

Microspray apparatus and methods involve injecting powdered material into a plasma gas stream (21). The material comprises first and second component powders. The second powder is a majority by the weight of the powdered material. The first powder acts as a melting point depressant. The first and second powders may have similar compositions but with the first powder including a greater quantity of a melting point depressant element.