Use of a polyamide moulding composition with high melt rigidity for coextruding with a polymer melting at a high temperature

The use of moulding materials (I) containing (a) 100 parts by weight (pts. wt.) polyamide and (b) 0.005-10 pts. wt. of a compound (II) with at least two carbonate units, for coextrusion with a moulding material (III) based on a high-melting polymer with a crystallite melting point (Tm) of at least 2...

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Main Authors Böer, Michael, Dowe, Andreas, Himmelmann, Martin, Göring, Rainer, Kuhmann, Karl Dr, Baumann, Franz-Erich, Dr, Wursche, Roland, Dr
Format Patent
LanguageEnglish
French
German
Published 05.12.2018
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Summary:The use of moulding materials (I) containing (a) 100 parts by weight (pts. wt.) polyamide and (b) 0.005-10 pts. wt. of a compound (II) with at least two carbonate units, for coextrusion with a moulding material (III) based on a high-melting polymer with a crystallite melting point (Tm) of at least 255 deg C and/or a glass transition point(Tg)of at least 180 deg C. Independent claims are included for (1) a method for the production of multilayer composites by making a polyamide moulding material, mixing this with 0.005-10 pts. wt. (II) per 100 pts. wt. polyamide, optionally storing and/or transporting the mixture and then coextruding it with (III) (2) multilayer composites obtained by this method .
Bibliography:Application Number: EP20060114974