SANDWICHED THERMAL SOLUTION

A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shieldin...

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Bibliographic Details
Main Authors TOZAWA, Masaaki, FUJIWARA, Kikuo, NORLEY, Julian, SHIVES, Gary, D, REYNOLDS, Robert, Anderson, III
Format Patent
LanguageEnglish
French
German
Published 26.09.2018
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEATING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
WEAPONS
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Summary:A thermal solution (10) for an electronic device, which is positioned between a heat source (100) and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution (10) facilitates heat dissipation from the heat source (100) while shielding the external surface and/or second component from the heat generated by the heat source (100).
Bibliography:Application Number: EP20040794219