STRUCTURING OF ELECTRICAL FUNCTIONAL LAYERS BY MEANS OF A TRANSFER FILM AND STRUCTURING THE ADHESIVE

• Main Authors: WILD, HEINRICH, HANSEN, ACHIM, BREHM, LUDWIG
• Format: Patent
• Language: English; French; German
• Published: 26.05.2010
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The invention concerns a film having at least one electrical component and a process for the production of such a film. An adhesive layer comprising a radiation-cross-linkable adhesive is applied to a base film. The adhesive layer is applied to the base film in a form of being structured in pattern form and/or is irradiated in pattern form in such a way that the adhesive layer hardens with structuring in pattern form. A transfer film which comprises a carrier film and an electrical functional layer is applied to the adhesive layer. The carrier film is pulled off the film body comprising the base film, the adhesive layer and the electrical functional layer, wherein in a first region structured in pattern form the electrical functional layer remains on the base film and in a second region structured in pattern form the electrical functional layer remains on the carrier film and is pulled off the base film with the carrier film.