Capacitive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150.

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Bibliographic Details
Main Author COX, SIDNEY G
Format Patent
LanguageEnglish
French
German
Published 28.01.2009
Subjects
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Summary:The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150.
Bibliography:Application Number: EP20050257897