Capacitive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150.
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
28.01.2009
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a dielectric composition comprising: paraelectric filler; and polymer wherein said paraelectric filler has a dielectric constant between 50 and 150. |
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Bibliography: | Application Number: EP20050257897 |