Method for manufacturing a three-dimensional interconnected support for light emitting diodes

The method involves flexing notches of a lower layer (501) of a substrate (500) to deform the lower layer without rupturing an upper layer (503). LEDs are arranged on the upper layer. The substrate (500) is arranged along two different maintenance planes (P1,P2). The changing of level between two su...

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Bibliographic Details
Main Authors NICOLAI, JEAN-MARC, RICHARD, STÉPHANE
Format Patent
LanguageEnglish
French
German
Published 29.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The method involves flexing notches of a lower layer (501) of a substrate (500) to deform the lower layer without rupturing an upper layer (503). LEDs are arranged on the upper layer. The substrate (500) is arranged along two different maintenance planes (P1,P2). The changing of level between two successive maintenance planes is ensured by presence of the notches of lower layer to deform the substrate.
Bibliography:Application Number: EP20050292453