LEAD FREE ALLOYS FOR COLUMN/BALL GRID ARRAYS, ORGANIC INTERPOSERS AND PASSIVE COMPONENT ASSEMBLY

A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit...

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Bibliographic Details
Main Authors INTERRANTE, MARIO, J, FAROOQ, MUKTA, G
Format Patent
LanguageEnglish
French
German
Published 08.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit chip with a suitable lead free solder alloy.
Bibliography:Application Number: EP20030790123